Composite electronic component and board having the same

ABSTRACT

A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body having a common mode choke coil, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2014-0158505 filed on Nov. 14, 2014, with the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND

The present disclosure relates to a composite electronic componentincluding a plurality of passive elements and a board having the same.

In accordance with recent demand for thinness and lightness ofelectronic devices, as well as improved performance, electronic deviceshave been required to have a significantly decreased size and variousfunctions.

Among these electronic devices, in PCs, TVs, or the like, to which adifferential transmission scheme of a low-speed signal is applied, acommon mode filter (CMF) for removing common mode noise has been used.

In addition, a multilayer ceramic capacitor for a differential filterhas been used in series and parallel with the common mode filter (CMF)as a filter for differential transmission.

However, since electronic devices perform various functions, the numberof common mode filters (CMF) and multilayer ceramic capacitors hasincreased, and the number of other passive elements has also increased.

In this case, the component disposition area of electronic devices mustbe increased, which may limit miniaturization of electronic devices.

Therefore, research into technology for decreasing the componentdisposition area of electronic devices and manufacturing costs is stillrequired.

SUMMARY

An aspect of the present disclosure may provide a composite electroniccomponent in which component mounting area may be reduced in PCs, TVs,or the like, to which a differential transmission scheme of a low-speedsignal is applied, and a board having the same.

An aspect of the present disclosure may also provide a compositeelectronic component for removing common mode noise in PCs, TVs, or thelike, to which a differential transmission scheme of a low-speed signalis applied, and a board having the same.

According to an aspect of the present disclosure, a composite electroniccomponent may include a composite body in which a common mode filter anda multilayer ceramic capacitor array are coupled to each other. Thecommon mode filter includes a first body in which a common mode chokecoil is disposed and an electro static discharge (ESD) protectionelement is included. The multilayer ceramic capacitor array includes asecond body in which a plurality of dielectric layers are stacked. Firstto fourth external electrodes are disposed on both side surfaces of thefirst body and electrically connected to the common mode choke coil.First and second dummy electrodes are disposed on both side surfaces ofthe first body and insulated from the first to fourth externalelectrodes. Fifth to eighth external electrodes disposed on both sidesurfaces of the second body. Third and fourth dummy electrodes disposedon both side surfaces of the second body and insulated from the fifth toeighth external electrodes. Here, the composite body may include firstand second input terminals formed by coupling of the first externalelectrode and the third dummy electrode and coupling of the secondexternal electrode and fourth dummy electrode, respectively, first andsecond output terminals formed by coupling of the third and fifthexternal electrodes and coupling of the fourth and sixth externalelectrodes, respectively, and first and second ground terminals formedby coupling of the first dummy electrode and the seventh externalelectrode and coupling of the second dummy electrode and the eighthexternal electrode, respectively.

According to another aspect of the present disclosure, a board having acomposite electronic component may include a printed circuit board onwhich three or more electrode pads are formed, the composite electroniccomponent mounted on the printed circuit board, and solders connectingthe electrode pads and the composite electronic component to each other.Here, the composite electronic component may include a composite body inwhich a common mode filter and a multilayer ceramic capacitor array arecoupled to each other, the common mode filter including a first body inwhich a common mode choke coil is disposed and an electro staticdischarge (ESD) protection element is included, and the multilayerceramic capacitor array including a second body in which a plurality ofdielectric layers are stacked, first to fourth external electrodesdisposed on both side surfaces of the first body and electricallyconnected to the common mode choke coil, and first and second dummyelectrodes disposed on both side surfaces of the first body andinsulated from the first to fourth external electrodes, and fifth toeighth external electrodes disposed on both side surfaces of the secondbody, and third and fourth dummy electrodes disposed on both sidesurfaces of the second body and insulated from the fifth to eighthexternal electrodes. Here, the composite body may include first andsecond input terminals formed by coupling of the first externalelectrode and the third dummy electrode and coupling of the secondexternal electrode and fourth dummy electrode, respectively, first andsecond output terminals formed by coupling of the third and fifthexternal electrodes and coupling of the fourth and sixth externalelectrodes, respectively, and first and second ground terminals formedby coupling of the first dummy electrode and the seventh externalelectrode and coupling of the second dummy electrode and the eighthexternal electrode, respectively.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective diagram schematically illustrating a compositeelectronic component according to an exemplary embodiment in the presentdisclosure;

FIG. 2 is a schematic perspective diagram illustrating a form in whicheach of the components is coupled to one another in the compositeelectronic component of FIG. 1;

FIG. 3 is an exploded perspective diagram illustrating a form in whichinternal electrodes and dielectric layers of a multilayer ceramiccapacitor array of FIG. 1 are stacked according to an exemplaryembodiment in the present disclosure;

FIG. 4 is an exploded perspective diagram illustrating a form in whichinternal electrodes and dielectric layers of a multilayer ceramiccapacitor array of FIG. 1 are stacked according to another exemplaryembodiment in the present disclosure;

FIG. 5 is an exploded perspective diagram illustrating a form in whichinternal electrodes and dielectric layers of a multilayer ceramiccapacitor array of FIG. 1 are stacked according to another exemplaryembodiment in the present disclosure;

FIG. 6 is an exploded perspective diagram illustrating a form in whichinternal electrodes and dielectric layers of a multilayer ceramiccapacitor array of FIG. 1 are stacked according to another exemplaryembodiment in the present disclosure;

FIG. 7 is a circuit diagram to which the composite electronic componentaccording to the exemplary embodiment is applied;

FIG. 8 is a diagram illustrating a disposition pattern of a system towhich the composite electronic component according to the exemplaryembodiment is applied;

FIG. 9 is a perspective diagram illustrating the composite electroniccomponent of FIG. 1 mounted on a printed circuit board; and

FIGS. 10A and 10B are graphs illustrating attenuation versus frequencyof Comparative Example and an Inventive Example in the presentdisclosure, respectively.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

The disclosure may, however, be embodied in many different forms andshould not be construed as being limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of thedisclosure to those skilled in the art.

In the drawings, the shapes and dimensions of elements may beexaggerated for clarity, and the same reference numerals will be usedthroughout to designate the same or like elements.

Composite Electronic Component

FIG. 1 is a perspective diagram schematically illustrating a compositeelectronic component according to an exemplary embodiment in the presentdisclosure.

FIG. 2 is a schematic perspective diagram illustrating a form in whicheach of the components is coupled to one another in the compositeelectronic component of FIG. 1.

Referring to FIG. 1, in the composite electronic component, according tothe exemplary embodiment, a ‘length direction’ refers to an ‘L’direction of FIG. 1, a ‘width direction’ refers to a ‘W’ direction ofFIG. 1, and a ‘thickness direction’ refers to a ‘T’ direction of FIG. 1.

Meanwhile, the length, width, and thickness directions of the compositeelectronic component may be the same as length, width, and thicknessdirections of a common mode filter and a multilayer ceramic capacitorarray, respectively, as described below.

In addition, in the exemplary embodiment in the present disclosure, thecomposite electronic component may have upper and lower surfacesopposing each other, first and second side surfaces and first and secondend surfaces that connect the upper and lower surfaces to each other. Ashape of the composite electronic component is not particularly limited,but may be hexahedral as shown.

Further, the first and second end surfaces of the composite electroniccomponent in the length direction and the first and second side surfacesthereof in the width direction may be defined as surfaces in the samedirections as directions of first and second end surfaces of the commonmode filter and the multilayer ceramic capacitor array in the lengthdirection and first and second side surfaces of the common mode filterand the multilayer ceramic capacitor array in the width direction,respectively, as described below.

However, as illustrated in FIG. 1, an upper or lower surface of thecommon mode filter and an upper or lower surface of the multilayerceramic capacitor array may be coupling surfaces coupled to each other.

Meanwhile, in the composite electronic component, the common mode filterand the multilayer ceramic capacitor array may be coupled to each other,and in a case in which the multilayer ceramic capacitor array is coupledon the common mode filter, the upper surface of the composite electroniccomponent may be defined as the upper surface of the multilayer ceramiccapacitor array, and the lower surface of the composite electroniccomponent may be defined as the lower surface of the common mode filter.

In the first and second side surfaces may correspond to surfaces of thecomposite electronic component opposing each other in the widthdirection, the first and second end surfaces may correspond to surfacesof the composite electronic component opposing each other in the lengthdirection, and the upper and lower surfaces may correspond to surfacesof the composite electronic component opposing each other in thethickness direction.

Referring to FIGS. 1 and 2, a composite electronic component 100,according to the exemplary embodiment in the present disclosure, mayinclude a composite body 130 in which a common mode filter 110 and amultilayer ceramic capacitor array 120 are coupled to each other,wherein the common mode filter 110 includes a first body in which acommon mode choke coil is disposed, and the multilayer ceramic capacitorarray 120 includes a second body in which a plurality of dielectriclayers are stacked.

A shape of the composite body 130 is not particularly limited, but maybe hexahedral as shown.

The hexahedral composite body 130 may be formed by coupling the commonmode filter 110 and the multilayer ceramic capacitor array 120 to eachother, and a method of forming the composite body 130 is notparticularly limited.

For example, the composite body 130 may be formed by coupling theseparately manufactured common mode filter 110 and multilayer ceramiccapacitor array 120 to each other using a conductive adhesive, a resin,or the like, but the method of forming the composite body 130 is notparticularly limited thereto.

Particularly, the adhesive or resin used to couple the common modefilter 110 and the multilayer ceramic capacitor array 120 to each othermay contain, for example, an epoxy resin, but is not limited thereto.

A method of coupling the common mode filter 110 and the multilayerceramic capacitor array 120 to each other using the conductive adhesive,the resin, or the like, is not particularly limited. For example, thecommon mode filter 110 and the multilayer ceramic capacitor array 120may be coupled to each other by applying, heating, and curing theconductive adhesive, the resin, or the like, onto the coupling surfaceof the common mode filter 110 or the multilayer ceramic capacitor array120.

Meanwhile, according to the exemplary embodiment, the multilayer ceramiccapacitor array 120 may be disposed on the common mode filter 110.

Therefore, the transferring of vibrations of the capacitor due to aninverse piezoelectric property of the multilayer ceramic capacitor array120 to a board may be reduced, such that acoustic noise may be reduced.

Further, according to another exemplary embodiment in the presentdisclosure, the multilayer ceramic capacitor array 120 may be disposedbeneath the common mode filter 110. However, a disposition form of themultilayer ceramic capacitor array 120 is not particularly limited.

Hereinafter, the common mode filter 110 and the multilayer ceramiccapacitor array 120 configuring the composite body 130 will be describedin detail.

According to the exemplary embodiment, the first body configuring thecommon mode filter 110 may contain the common mode choke coil (notillustrated).

The common mode filter 110 is not particularly limited. For example, anyfilter may be used as long as it is a filter for removing common modenoise in an application to which a differential transmission scheme of alow-speed signal is applied.

The common mode filter 110 may have a structure in which the first bodyincludes the common mode choke coil (not illustrated) therein and isfilled with a magnetic material or ceramic, and terminal electrodes aredisposed on outer peripheral surfaces thereof.

For the magnetic material, a Ni—Cu—Zn based ferrite material, aNi—Cu—Zn—Mg based ferrite material, or a Mn—Zn based ferrite materialmay be used. However, the magnetic material is not limited thereto.

The common mode choke coil may have four exposed portions exposed toboth side surfaces of the first body of the common mode filter 110 inthe width direction.

The four exposed portions may be connected to first and second inputterminals 151 a and 151 b and first and second output terminals 152 aand 152 b, respectively, as described below.

Meanwhile, according to the exemplary embodiment in the presentdisclosure, the common mode filter 110 may further include an electrostatic discharge (ESD) protection element therein.

For the electro static discharge (ESD) protection element, any elementmay be used as long as it has a function in which an electricaloverstress (EOS) component in an input signal can be bypassed.

For example, the electro static discharge (ESD) protection element maybe formed by sequentially disposing an electro static preventionelectrode, an electro static prevention paste, and a protection layer inor on the first body. Alternatively, a separately manufactured electrostatic discharge (ESD) protection element may be disposed in or on thefirst body.

The second body configuring the multilayer ceramic capacitor array 120may be formed by stacking the plurality of dielectric layers, and aplurality of internal electrodes may be disposed to be separated fromeach other in the second body with the dielectric layers interposedtherebetween.

The plurality of dielectric layers configuring the second body may be ina sintered state, and adjacent dielectric layers may be integrated witheach other so that boundaries therebetween are not readily apparent.

The dielectric layers may be formed by sintering ceramic green sheetscontaining ceramic powder, an organic solvent, and an organic binder.The ceramic powder, which is a material having high permittivity, may bea barium titanate (BaTiO₃) based material, a strontium titanate (SrTiO₃)based material, or the like, but is not limited thereto.

A detailed description of an internal structure of the multilayerceramic capacitor array 120 will be provided below.

The composite electronic component 100, according to the exemplaryembodiment in the present disclosure, may include first to fourthexternal electrodes 151 a, 151 b, 152 a, and 152 b disposed on both sidesurfaces of the first body and electrically connected to the common modechoke coil, first and second dummy electrodes 163 a and 163 b disposedon both side surfaces of the first body and spaced apart from the firstto fourth external electrodes 151 a, 151 b, 152 a, and 152 b, fifth toeighth external electrodes 152′a, 152′b, 153 a, and 153 b disposed onboth side surfaces of the second body, and third and fourth dummyelectrodes 161 a and 161 b disposed on both side surfaces of the secondbody and insulated from the fifth to eighth external electrodes 152′a,152′b, 153 a, and 153 b. As used herein, the term “dummy electrode”means that the electrode is not electrically connected with respect toelements of the body on which it is disposed, e.g., first and seconddummy electrodes 163 a and 163 b with respect to elements of the firstbody, but may still be electrically connected with elements of otherbodies, e.g., first and second dummy electrodes 163 a and 163 belectrically connected to seventh and eighth external electrodes 153 aand 153 b, respectively, on the second body.

The first to fourth external electrodes 151 a, 151 b, 152 a, and 152 bmay each be formed on one of the side surfaces of the first body in thewidth direction and partially extended respectively on the upper andlower surfaces of the first body.

The first to fourth external electrodes 151 a, 151 b, 152 a, and 152 bmay be disposed to be spaced apart from each other, the first and secondexternal electrodes 151 a and 151 b may be disposed to face each other,and the third and fourth external electrodes 152 a and 152 b may bedisposed to face each other.

The first and second dummy electrodes 163 a and 163 b may be disposedrespectively on the side surfaces of the first body in the widthdirection, spaced apart from the first to fourth external electrodes 151a, 151 b, 152 a, and 152 b, and partially extended on the respectiveupper and lower surfaces of the first body.

In detail, the common mode filter 110 included in the compositeelectronic component, according to the exemplary embodiment in thepresent disclosure, may include the first to fourth external electrodes151 a, 151 b, 152 a, and 152 b and the first and second dummy electrodes163 a and 163 b, such that the common mode filter 110 may be asix-terminal filter.

Further, the multilayer ceramic capacitor array 120 may include thefifth to eighth external electrodes 152′a, 152′b, 153 a, and 153 b eachdisposed on one of the side surfaces of the second body and the thirdand fourth dummy electrodes 161 a and 161 b disposed respectively on theside surfaces of the second body and insulated from the fifth to eighthexternal electrodes 152′a, 152′b, 153 a, and 153 b.

The fifth to eighth external electrodes 152′a, 152′b, 153 a, and 153 bmay each be formed on one of the side surfaces of the second body in thewidth direction, and partially extended on the respective upper andlower surfaces of the second body.

Further, the third and fourth dummy electrodes 161 a and 161 b may beformed on both side surfaces of the second body in the width directionand extended to the upper and lower surfaces of the second body.

The composite body 130 may include first input terminals 151 a and 161 aand second input terminals 151 b and 161 b formed by the coupling of thefirst external electrode 151 a and the third dummy electrode 161 a andthe coupling of the second external electrode 151 b and the fourth dummyelectrode 161 b, respectively. The composite body 130 may furtherinclude first output terminals 152 a and 152′a and second outputterminals 152 b and 152′b formed by the coupling of the third and fifthexternal electrodes 152 a and 152′a and the coupling of the fourth andsixth external electrodes 152 b and 152′b, respectively. The compositebody 130 may further include first and second ground terminals formed bythe coupling of the first dummy electrode 163 a and the seventh externalelectrode 153 a and the coupling of the second dummy electrode 163 b andthe eighth external electrode 153 b, respectively.

The first and second input terminals may serve as the first and secondexternal electrodes 151 a and 151 b of the common mode filter 110, andthe third and fourth dummy electrodes 161 a and 161 b disposed on themultilayer ceramic capacitor array 120 may serve only as terminalscoupled respectively to the first and second external electrodes 151 aand 151 b.

Further, in the first output terminals 152 a and 152′a, a signal appliedto the common mode filter 110 may be output through the multilayerceramic capacitor array 120 via the third and fifth external electrodes152 a and 152′a.

Similarly, in the second output terminals 152 b and 152′b, the signalapplied to the common mode filter 110 may be output through themultilayer ceramic capacitor array 120 via the fourth and sixth externalelectrodes 152 b and 152′b.

The first and second ground terminals may serve as the seventh andeighth external electrodes 153 a and 153 b of the multilayer ceramiccapacitor array 120, and the first and second dummy electrodes 163 a and163 b disposed on the common mode filter 110 may serve as paths throughwhich noise filtered in the composite electronic component is bypassedto the ground.

The first to fourth external electrodes and the first and second dummyelectrodes disposed on the common mode filter 110 and the fifth toeighth external electrodes and the third and fourth dummy electrodesdisposed on the multilayer ceramic capacitor array 120, which form theinput terminals, the output terminals, and the ground terminals, may becoupled to each other by a conductive adhesive, respectively, but acoupling method thereof is not necessarily limited thereto.

In PCs, TVs, or the like, to which the differential transmission schemeof the low-speed signal is applied, the first input terminals 151 a and161 a and the first output terminals 152 a and 152′a of the compositeelectronic component, according to the exemplary embodiment in thepresent disclosure, may be connected to the common mode choke coil ofthe common mode filter 110 to thereby serve as one coil part in thecomposite electronic component.

The second input terminals 151 b and 161 b and the second outputterminals 152 b and 152′b may be connected to the common mode choke coilof the common mode filter 110 to thereby serve as the other coil part inthe composite electronic component.

The first input terminals 151 a and 161 a, the second input terminals151 b and 161 b, the first output terminals 152 a and 152′a, the secondoutput terminals 152 b and 152′b, and the first and second groundterminals 153 a, 163 a, 153 b, and 163 b may be formed of a conductivepaste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), tin (Sn), or analloy thereof, but is not limited thereto.

The conductive paste may further contain an insulating material. Theinsulating material may be, for example, glass, but is not limitedthereto.

A method of forming the input terminals, the output terminals, and theground terminals is not particularly limited. In detail, inputterminals, the output terminals, and the ground terminals may be formedby a dipping process of the composite body or may be formed by anothermethod such as a plating method, or the like.

Referring to FIGS. 1 and 2, in the composite electronic component,according to the exemplary embodiment, the multilayer ceramic capacitorarray 120 and the common mode filter 110 are coupled to each otherunlike that of the related art, such that the multilayer ceramiccapacitor array 120 and the common mode filter 110 may be designed tohave as short a distance as possible therebetween, thereby reducingnoise.

Further, since the multilayer ceramic capacitor array 120 and the commonmode filter 110 are coupled to each other, a mounting area in the PC,the TV, or the like, to which the differential transmission scheme ofthe low-speed signal is applied may be significantly reduced, which maybe advantageous for securing mounting space.

Further, manufacturing costs, such as mounting costs, or the like, maybe reduced.

Further, in the composite electronic component, the multilayer ceramiccapacitor array 120 is formed on the common mode filter 110, such thatat the time of mounting the composite electronic component on the board,the transferring of vibrations of the capacitor due to the inversepiezoelectric property of the capacitor to the board may be reduced,thereby reducing acoustic noise.

FIG. 3 is an exploded perspective diagram illustrating a form in whichinternal electrodes and dielectric layers of a multilayer ceramiccapacitor array of FIG. 1 are stacked according to an exemplaryembodiment in the present disclosure.

FIG. 4 is an exploded perspective diagram illustrating a form in whichinternal electrodes and dielectric layers of a multilayer ceramiccapacitor array of FIG. 1 are stacked according to an exemplaryembodiment in the present disclosure.

Referring to FIG. 3, in a composite electronic component, according tothe exemplary embodiment in the present disclosure, a plurality ofdielectric layers 111 and first to fourth internal electrodes 121, 122,121′ and 122′ may be disposed in a multilayer ceramic capacitor array120.

In the multilayer ceramic capacitor array 120, a plurality of dummydielectric layers 111 may be inserted between the dielectric layers 111on which the first to fourth internal electrodes 121, 122, 121′, and122′ are disposed.

The plurality of dummy dielectric layers 111 may be inserted between thedielectric layers 111 on which the first to fourth internal electrodes121, 122, 121′, and 122′ are disposed as described above, such thatcrosstalk between first output terminals 152 a and 152′a and secondoutput terminals 152 b and 152′b may be prevented.

Therefore, attenuation of a signal may be excellent in a wide frequencyband.

The compositions of the dielectric layers and the dummy dielectriclayers may be the same as each other and are not particularly limited.

Referring to FIG. 4, in a composite electronic component according tothe exemplary embodiment in the present disclosure, dielectric layers111 and dummy dielectric layers 111′ may have different compositionsfrom each other.

A plurality of dummy dielectric layers 111′ having a differentcomposition from the dielectric layers 111 may be inserted between thedielectric layers 111 on which first to fourth internal electrodes 121,122, 121′, and 122′ are disposed as described above, such that crosstalkbetween first output terminals 152 a and 152′a and second outputterminals 152 b and 152′b may be prevented.

The first to fourth internal electrodes 121, 122, 121′, and 122′ havingleads externally exposed may be stacked in a second body.

The first to fourth internal electrodes 121, 122, 121′, and 122′ may bestacked perpendicularly to a mounting surface of the composite body 130.

In detail, the first to fourth internal electrodes 121, 122, 121′, and122′ may be disposed perpendicularly to upper and lower surfaces of themultilayer ceramic capacitor array 120.

The leads of the first and second internal electrodes 121 and 122 may beexposed to the upper surface of the multilayer ceramic capacitor array120, and the leads of the third and fourth internal electrodes 121′ and122′ may be exposed to the lower surface of the multilayer ceramiccapacitor array 120.

Fifth to eighth external electrodes 152′a, 153 a, 152′b, and 153 b maybe connected to the first to fourth internal electrodes 121, 122, 121′,and 122′, respectively.

FIG. 5 is an exploded perspective diagram illustrating a form in whichinternal electrodes and dielectric layers of a multilayer ceramiccapacitor array of FIG. 1 are stacked according to another exemplaryembodiment in the present disclosure.

Referring to FIG. 5, in a composite electronic component, according tothe exemplary embodiment in the present disclosure, a plurality ofdielectric layers 211 and first to fourth internal electrodes 221, 222,221′ and 222′ may be disposed in a multilayer ceramic capacitor array120.

In the multilayer ceramic capacitor array 120, a plurality of dummydielectric layers 211 may be inserted between the dielectric layers 211on which the first to fourth internal electrodes 221, 222, 221′, and222′ are disposed.

The plurality of dummy dielectric layers 211 may be inserted between thedielectric layers 211 on which the first to fourth internal electrodes221, 222, 221′, and 222′ are disposed as described above, such thatcrosstalk between first output terminals 152 a and 152′a and secondoutput terminals 152 b and 152′b may be prevented.

The first to fourth internal electrodes 221, 222, 221′, and 222′ may bestacked in parallel with a mounting surface of the composite body 130.

In detail, the first to fourth internal electrodes 221, 222, 221′, and222′ may be disposed in parallel with upper and lower surfaces of themultilayer ceramic capacitor array 120.

Leads of the first and second internal electrodes 221 and 222 may beexposed to a first side surface of the multilayer ceramic capacitorarray 120 in a width direction, and leads of the third and fourthinternal electrodes 221′ and 222′ may be exposed to a second sidesurface of the multilayer ceramic capacitor array 120 in the widthdirection.

Fifth to eighth external electrodes 152′a, 153 a, 152′b, and 153 b maybe connected to the first to fourth internal electrodes 221, 222, 221′,and 222′, respectively.

FIG. 6 is an exploded perspective diagram illustrating a form in whichinternal electrodes and dielectric layers of a multilayer ceramiccapacitor array of FIG. 1 are stacked according to another exemplaryembodiment in the present disclosure.

According to the exemplary embodiment illustrated in FIG. 6, a pluralityof dummy dielectric layers 211′ having a different composition fromdielectric layers 211 may be inserted between the dielectric layers 211on which the first to fourth internal electrodes, 221, 222, 221′, and222′ are disposed, such that crosstalk between first output terminals152 a and 152′a and second output terminals 152 b and 152′b may beprevented.

The first to fourth internal electrodes may be formed of a conductivepaste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), oran alloy thereof, but is not limited thereto.

Although pattern shapes of the first to fourth internal electrodes areillustrated in FIGS. 3 through 6, the pattern shapes and the numbersthereof are not limited thereto. In detail, the pattern shapes and thenumbers thereof may be variously changed.

FIG. 7 is a circuit diagram to which the composite electronic component,according to the exemplary embodiment in the present disclosure, isapplied.

Referring to FIG. 7, a connector 300 and a composite electroniccomponent 400 may be connected to each other.

A low-speed signal transmitted from the connector 300 may be applied totwo input terminals of the composite electronic component 400 by adifferential transmission scheme, and the composite electronic componentmay be composed of a common mode filter 110 embedded with an ESD elementand a multilayer ceramic capacitor array 120.

The common mode filter 110 embedded with the ESD element and themultilayer ceramic capacitor array 120 may be mounted as the compositeelectronic component 130, which is a single component, on a board, suchthat a component disposition area may be reduced, and generation ofnoise may be suppressed.

FIG. 8 is a diagram illustrating a disposition pattern of a system towhich the composite electronic component, according to the exemplaryembodiment in the present disclosure, is applied.

Referring to FIG. 8, it may be confirmed that four ESD elements, thecommon mode filter, and two multilayer ceramic capacitors illustrated inFIG. 7 are illustrated as the composite electronic component in whichthe common mode filter 110 and the multilayer ceramic capacitor array120 are coupled to each other according to the exemplary embodiment inthe present disclosure.

As described above, the composite electronic component may perform anoise removal function of removing common mode noise in a differentiallytransmitted signal.

In addition, the number of disposed elements is decreased, such that theelements may be optimally disposed.

Further, according to the exemplary embodiment, the common mode filter110 and the multilayer ceramic capacitor array 120 may be disposed to beas close to each other as possible, such that a wiring of a power linemay be designed to be short and thick.

Therefore, noise generated when the wiring is disposed to be elongatedmay be reduced.

Meanwhile, in order to satisfy customers' demands, electronic devicemanufacturers have made efforts to reduce the size of printed circuitboards (PCBs) included in electronic devices.

Therefore, an increase in the degree of integration of an integratedcircuit (IC) mounted on PCBs has been required.

This requirement may be satisfied by configuring a plurality of elementsas a single composite component, as in the composite electroniccomponent according to the exemplary embodiment in the presentdisclosure.

In addition, according to the exemplary embodiment, seven components(four ESD elements, the common mode filter, and two multilayer ceramiccapacitors) may be implemented as the single composite electroniccomponent, such that the mounting area of a printed circuit board (PCB)may be decreased.

According to the present embodiment, the mounting area may be decreasedby about 50% to 70% as compared to an existing disposition pattern.

Board Having Composite Electronic Component

FIG. 9 is a perspective diagram illustrating a form in which thecomposite electronic component of FIG. 1 is mounted on a printed circuitboard.

Referring to FIG. 9, a board 500 having a composite electronic componentaccording to the present exemplary embodiment may include a printedcircuit board 510 on which the composite electronic component is mountedand a plurality of electrode pads 521, 521′, 523, and 523′ disposed onan upper surface of the printed circuit board 510.

The electrode pads may be composed of first to fourth electrode pads521, 521′, 523, and 523′ connected to the input terminals 151 a and 151b and the ground terminals 163 a and 163 b of the composite electroniccomponent, respectively.

In this case, the input terminals 151 a and 151 b and the groundterminals 163 a and 163 b of the composite electronic component may beconnected to the printed circuit board 510 by solders 530 in a state inwhich the input terminals 151 a and 151 b and the ground terminals 163 aand 163 b are positioned on the first to fourth electrode pads 521,521′, 523, and 523′ so as to come in contact with each other,respectively.

A description of features of the board having a composite electroniccomponent according to another exemplary embodiment overlapping withthose of the composite electronic component according to the exemplaryembodiment in the present disclosure as described above will be omittedin order to avoid an overlapping description.

FIGS. 10A and 10B are graphs illustrating attenuation versus frequencyof a Comparative Example and an Inventive Example in the presentdisclosure, respectively.

Referring to FIGS. 10A and 10B, it may be appreciated that in a case inwhich dummy dielectric layers are inserted into a multilayer ceramiccapacitor array (Inventive Example, FIG. 10B), the pass characteristics,in detail, attenuation, is improved by about −15 dB or so as compared toa multilayer ceramic 20 capacitor array having a general structure inwhich the dummy dielectric layers are not inserted (Comparative Example,FIG. 10A).

As set forth above, according to exemplary embodiments in the presentdisclosure, the composite electronic component for reducing thecomponent mounting area in PCs, TVs, or the like, to which thedifferential transmission scheme of the low-speed signal is applied, andreducing manufacturing costs may be provided.

In addition, the composite electronic component in which common modenoise may be removed in PCs, TVs, or the like, to which the differentialtransmission scheme of the low-speed signal is applied may be provided.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A composite electronic component comprising: acommon mode filter including a first body having a common mode chokecoil; a multilayer ceramic capacitor array coupled to the common modefilter and including a second body in which a plurality of dielectriclayers are stacked; first and third external electrodes disposed on aside surface of the first body and electrically connected to the commonmode choke coil; second and fourth external electrodes disposed on anopposing side surface of the first body and electrically connected tothe common mode choke coil; first and second dummy electrodesrespectively disposed on the side surface and the opposing side surfaceof the first body and spaced apart from the first to fourth externalelectrodes; fifth and seventh external electrodes disposed on a sidesurface of the second body; sixth and eighth external electrodesdisposed on an opposing side surface of the second body; and third andfourth dummy electrodes respectively disposed on the side surface andthe opposing side surface of the second body and spaced apart from thefifth to eighth external electrodes; wherein the first externalelectrode is coupled to the third dummy electrode, the second externalelectrode is coupled to the fourth dummy electrode, the third externalelectrode is coupled to the fifth external electrode, the fourthexternal electrode is coupled to the sixth external electrode, the firstdummy electrode is coupled to the seventh external electrode, and thesecond dummy electrode is coupled to the eighth external electrode, andwherein inside the multilayer ceramic capacitor array, a plurality ofdummy dielectric layers on which no internal electrodes are disposed areinserted between dielectric layers on which internal electrodes aredisposed.
 2. The composite electronic component of claim 1, wherein thecommon mode filter and the multilayer ceramic capacitor array arecoupled to each other by a conductive adhesive.
 3. The compositeelectronic component of claim 1, wherein the dielectric layers and thedummy dielectric layers are of different compositions.
 4. The compositeelectronic component of claim 1, wherein the second body includes firstto fourth internal electrodes stacked therein and having leads exposedexternally.
 5. The composite electronic component of claim 4, whereinthe fifth to eighth external electrodes are connected to the first tofourth internal electrodes, respectively.
 6. The composite electroniccomponent of claim 4, wherein: the first to fourth internal electrodesare perpendicular to a mounting surface of the composite electroniccomponent, and the fifth to eighth external electrodes respectivelypartially extend on at least one of the upper or lower surfaces of thesecond body.
 7. The composite electronic component of claim 1, whereinthe multilayer ceramic capacitor array is coupled to an upper portion ofthe common mode filter.
 8. A board having a composite electroniccomponent, the board comprising: a printed circuit board on which aplurality of electrode pads are formed; a composite electronic componentmounted on the printed circuit board; and solders connecting theelectrode pads and the composite electronic component to each other,wherein the composite electronic component includes: a common modefilter including a first body having a common mode choke coil; amultilayer ceramic capacitor array coupled to the common mode filter andincluding a second body in which a plurality of dielectric layers arestacked; first and third external electrodes disposed on a side surfaceof the first body and electrically connected to the common mode chokecoil; second and fourth external electrodes disposed on an opposing sidesurface of the first body and electrically connected to the common modechoke coil; first and second dummy electrodes respectively disposed onthe side surface and the opposing side surface of the first body andspaced apart from the first to fourth external electrodes; fifth andseventh external electrodes disposed on a side surface of the secondbody; sixth and eighth external electrodes disposed on an opposing sidesurface of the second body; and third and fourth dummy electrodesrespectively disposed on the side surface and the opposing side surfaceof the second body and spaced apart from the fifth to eighth externalelectrodes; wherein the first external electrode is coupled to the thirddummy electrode, the second external electrode is coupled to the fourthdummy electrode, the third external electrode is coupled to the fifthexternal electrode, the fourth external electrode is coupled to thesixth external electrode, the first dummy electrode is coupled to theseventh external electrode, and the second dummy electrode is coupled tothe eighth external electrode, and wherein inside the multilayer ceramiccapacitor array, a plurality of dummy dielectric layers on which nointernal electrodes are disposed are inserted between dielectric layerson which internal electrodes are disposed.
 9. The board of claim 8,wherein the multilayer ceramic capacitor array is coupled to an upperportion of the common mode filter.
 10. The board of claim 8, wherein thecommon mode filter and the multilayer ceramic capacitor array arecoupled to each other by a conductive adhesive.
 11. The board of claim8, wherein the dielectric layers and the dummy dielectric layers are ofdifferent compositions.
 12. The board of claim 8, wherein the secondbody includes first to fourth internal electrodes stacked therein andhaving leads exposed externally.
 13. The board of claim 12, wherein thefifth to eighth external electrodes are connected to the first to fourthinternal electrodes, respectively.
 14. The board of claim 12, wherein:the first to fourth internal electrodes are perpendicular to a mountingsurface of the composite electronic component, and the fifth to eighthexternal electrodes respectively partially extend on at least one of theupper or lower surfaces of the second body.